Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability by Michael Pecht

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Michael Pecht

464 pages missing pub info (editions)

nonfiction art technology informative medium-paced
Powered by AI (Beta)
Loading...

Description

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectivenes...

Read more

Community Reviews

Loading...

Content Warnings

Loading...